Fumax Tech na-enye bọọdụ Circuit Printing kacha mma (PCB) gụnyere PCB multi-layer (bọọdụ sekit e biri ebi), HDI dị elu (njikọ njupụta dị elu), PCB na-enweghị ike na PCB na-agbanwe agbanwe… wdg.
Dị ka isi ihe, Fumax ghọtara mkpa nke a pụrụ ịdabere na àgwà nke PCB.Anyị na-etinye ego na akụrụngwa kachasị mma na otu ndị nwere nkà iji mepụta bọọdụ kacha mma.
Ụdị PCB a na-ahụkarị dị n'okpuru.
PCB siri ike
PCB Flex na-agbanwe agbanwe & nke siri ike
HDI PCB
PCB dị elu
Ọnụahịa kasị elu nke TG PCB
PCB LED
Metal isi PCB
Oke Cooper PCB
Aluminom PCB
E gosipụtara ike nrụpụta anyị na eserese dị n'okpuru.
| Ụdị | Ike |
| Oke | Multilayers(4-28) ,HDI(4-20)Flex, Rigid Flex |
| Akụkụ Abụọ | CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil-126mil (0.1mm-3.2mm) |
| Multilayers | 4-28 n'ígwé, osisi ọkpụrụkpụ 8mil-126mil (0.2mm-3.2mm) |
| E liri/Onye kpuru ìsì Site | 4-20 n'ígwé, osisi ọkpụrụkpụ 10mil-126mil (0.25mm-3.2mm) |
| HDI | 1+N+1,2+N+2,3+N+3, oyi akwa ọ bụla |
| PCB Flex & Rigid-Flex | 1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB |
| Laminate |
|
| Ụdị ihe mkpuchi (LPI) | Taiyo, Goo's, Probimer FPC..... |
| Soldermask peelable |
|
| Ink carbon |
|
| HASL/Lead efu HASL | Ọkpụrụkpụ: 0.5-40um |
| OSP |
|
| ENIG (Ni-Au) |
|
| Electro-bondable Ni-Au |
|
| Electro-nickel palladium Ni-Au | Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm |
| Electro.Ọlaedo siri ike |
|
| Tin gbara ọkpụrụkpụ |
|
| Ike | Mmepụta Mass |
| Min Mechanical Drill oghere | 0.20mm |
| Min.Laser Drill oghere | 4mil (0.100mm) |
| Obosara/Oghere Ahịrị | 2mil/2 nde |
| Oke.Nha panel | 21.5"X 24.5"(546mm X 622mm) |
| Ogologo ahịrị obosara/nnwere oghere | Ihe mkpuchi elektrọn: +/- 5um, mkpuchi elektrọn: +/- 10um |
| Ntachi obi nke oghere PTH | +/- 0.002 anụ ọhịa (0.050mm) |
| NPTH oghere ndidi | +/- 0.002 anụ ọhịa (0.050mm) |
| Nkwenye ebe oghere | +/- 0.002 anụ ọhịa (0.050mm) |
| Oghere ruo Edge ndidi | +/- 0.004 anụ ọhịa (0.100mm) |
| Nri ruo Edge ndidi | +/- 0.004 anụ ọhịa (0.100mm) |
| Layer ka Layer ndidi | +/- 0.003 anụ ọhịa (0.075mm) |
| Ntachi obi mgbochi | +/- 10% |
| Ibe akwụkwọ % | Kacha ≤0.5% |
Teknụzụ (ngwaahịa HDI)
| ITEM | Mmepụta |
| Laser Site Drill/pad | 0.125/0.30, 0.125/0.38 |
| Ndị ìsì Site Drill/pad | 0.25/0.50 |
| Obosara/Oghere Ahịrị | 0.10 / 0.10 |
| Nhazi oghere | CO2 Laser Direct Drill |
| Ihe Na-ewuli elu | FR4 LDP (LDD);RCC 50 ~ 100 micron |
| Cu Ọkpụrụkpụ na mgbidi oghere | oghere kpuru: 10um(min) |
| Akụkụ akụkụ | 0.8: 1 |
Teknụzụ (PCB na-agbanwe agbanwe)
| Ihe oru ngo | Ikike |
| Nyegharịa ka ọ tụgharịa (otu akụkụ) | EE |
| Nyefee ka ị tụgharịa (okpukpu abụọ) | NO |
| Olu a ga-atụgharị ihe obosara mm | 250 |
| Ogo mmepụta kacha nta mm | 250x250 |
| Oke mmepụta kacha mm | 500x500 |
| SMT Assembly patch (Ee/Ee e) | EE |
| Ike ikuku ikuku (Ee/Ee e) | EE |
| Mmepụta efere nke siri ike na dị nro (Ee / Mba) | EE |
| Oke oyiri (ike) | 10 |
| oyi akwa kacha ogologo(efere dị nro) | 6 |
| Sayensị ihe onwunwe |
|
| PI | EE |
| PET | EE |
| Electrolytic ọla kọpa | EE |
| Anneal ọla kọpa a na-atụgharị | EE |
| PI |
|
| Na-ekpuchi ntanye ntinye ihe nkiri mm | ±0.1 |
| Ihe nkiri mkpuchi kacha nta mm | 0.175 |
| Nkwanye |
|
| PI | EE |
| FR-4 | EE |
| SUS | EE |
| EMI SHIELDING |
|
| Ink ọla ọcha | EE |
| Ihe nkiri Silver | EE |