nke PCB - Shenzhen Fumax Technology Co., Ltd.
nyocha micro mgbawa

Fumax Tech na-enye bọọdụ Circuit Printing kacha mma (PCB) gụnyere PCB multi-layer (bọọdụ sekit e biri ebi), HDI dị elu (njikọ njupụta dị elu), PCB na-enweghị ike na PCB na-agbanwe agbanwe… wdg.

Dị ka isi ihe, Fumax ghọtara mkpa nke a pụrụ ịdabere na àgwà nke PCB.Anyị na-etinye ego na akụrụngwa kachasị mma na otu ndị nwere nkà iji mepụta bọọdụ kacha mma.

Ụdị PCB a na-ahụkarị dị n'okpuru.

PCB siri ike

PCB Flex na-agbanwe agbanwe & nke siri ike

HDI PCB

PCB dị elu

Ọnụahịa kasị elu nke TG PCB

PCB LED

Metal isi PCB

Oke Cooper PCB

Aluminom PCB

 

E gosipụtara ike nrụpụta anyị na eserese dị n'okpuru.

Ụdị

Ike

Oke

Multilayers(4-28) ,HDI(4-20)Flex, Rigid Flex

Akụkụ Abụọ

CEM-3, FR-4, Rogers RO4233, Bergquist Thermal Clad 4mil-126mil (0.1mm-3.2mm)

Multilayers

4-28 n'ígwé, osisi ọkpụrụkpụ 8mil-126mil (0.2mm-3.2mm)

E liri/Onye kpuru ìsì Site

4-20 n'ígwé, osisi ọkpụrụkpụ 10mil-126mil (0.25mm-3.2mm)

HDI

1+N+1,2+N+2,3+N+3, oyi akwa ọ bụla

PCB Flex & Rigid-Flex

1-8layers Flex PCB ,2-12layers Rigid-flex PCB HDI+Rigid-flex PCB

Laminate

 

Ụdị ihe mkpuchi (LPI)

Taiyo, Goo's, Probimer FPC.....

Soldermask peelable

 

Ink carbon

 

HASL/Lead efu HASL

Ọkpụrụkpụ: 0.5-40um

OSP

 

ENIG (Ni-Au)

 

Electro-bondable Ni-Au

 

Electro-nickel palladium Ni-Au

Au: 0.015-0.075um Pd 0.02-0.075um Ni: 2-6umm

Electro.Ọlaedo siri ike

 

Tin gbara ọkpụrụkpụ

 

Ike

Mmepụta Mass

Min Mechanical Drill oghere

0.20mm

Min.Laser Drill oghere

4mil (0.100mm)

Obosara/Oghere Ahịrị

2mil/2 nde

Oke.Nha panel

21.5"X 24.5"(546mm X 622mm)

Ogologo ahịrị obosara/nnwere oghere

Ihe mkpuchi elektrọn: +/- 5um, mkpuchi elektrọn: +/- 10um

Ntachi obi nke oghere PTH

+/- 0.002 anụ ọhịa (0.050mm)

NPTH oghere ndidi

+/- 0.002 anụ ọhịa (0.050mm)

Nkwenye ebe oghere

+/- 0.002 anụ ọhịa (0.050mm)

Oghere ruo Edge ndidi

+/- 0.004 anụ ọhịa (0.100mm)

Nri ruo Edge ndidi

+/- 0.004 anụ ọhịa (0.100mm)

Layer ka Layer ndidi

+/- 0.003 anụ ọhịa (0.075mm)

Ntachi obi mgbochi

+/- 10%

Ibe akwụkwọ %

Kacha ≤0.5%

Teknụzụ (ngwaahịa HDI)

ITEM

Mmepụta

Laser Site Drill/pad

0.125/0.30, 0.125/0.38

Ndị ìsì Site Drill/pad

0.25/0.50

Obosara/Oghere Ahịrị

0.10 / 0.10

Nhazi oghere

CO2 Laser Direct Drill

Ihe Na-ewuli elu

FR4 LDP (LDD);RCC 50 ~ 100 micron

Cu Ọkpụrụkpụ na mgbidi oghere

oghere kpuru: 10um(min)

Akụkụ akụkụ

0.8: 1

Teknụzụ (PCB na-agbanwe agbanwe)

Ihe oru ngo

Ikike

Nyegharịa ka ọ tụgharịa (otu akụkụ)

EE

Nyefee ka ị tụgharịa (okpukpu abụọ)

NO

Olu a ga-atụgharị ihe obosara mm

250

Ogo mmepụta kacha nta mm

250x250

Oke mmepụta kacha mm

500x500

SMT Assembly patch (Ee/Ee e)

EE

Ike ikuku ikuku (Ee/Ee e)

EE

Mmepụta efere nke siri ike na dị nro (Ee / Mba)

EE

Oke oyiri (ike)

10

oyi akwa kacha ogologo(efere dị nro)

6

Sayensị ihe onwunwe 

 

PI

EE

PET

EE

Electrolytic ọla kọpa

EE

Anneal ọla kọpa a na-atụgharị

EE

PI

 

Na-ekpuchi ntanye ntinye ihe nkiri mm

±0.1

Ihe nkiri mkpuchi kacha nta mm

0.175

Nkwanye 

 

PI

EE

FR-4

EE

SUS

EE

EMI SHIELDING

 

Ink ọla ọcha

EE

Ihe nkiri Silver

EE